SHIBATA, J.; MURAYAMA, N. Separation and Recovery of SiC Particles Discharged from Silicon Wafer Production Process. Journal of Applied Solution Chemistry and Modeling, [S. l.], v. 3, n. 1, p. 32–38, 2014. DOI: 10.6000/1929-5030.2014.03.01.4. Disponível em: https://mail.lifescienceglobal.com/pms/index.php/JASCM/article/view/1732. Acesso em: 21 nov. 2024.